制程:45纳米 , 主频:2.2GHz , HT总线:2GHz , 高速缓存:2M L2/6M L3 , DDR2内存最大频率:800MHz , 功率:55瓦 , 系统类型:双路 , 四核 .
Understanding Third-Generation AMD Opteron™ Processor Model Numbers
Third-Generation AMD Opteron™ processors are identified by a four digit model number, ZYXX, where:
Z indicates the maximum scalability of the processor.
1000 Series = 1-way servers and workstations
2000 Series = Up to 2-way servers and workstations
8000 Series = Up to 8-way servers and workstations
Y indicates socket generation. This digit is always ‘3’ for Third-Generation AMD Opteron processors for Socket F (1207) and Socket AM2.
1000 Series in Socket AM2 = Models 13XX
2000 Series in Socket F (1207) = Model 23XX
8000 Series in Socket F (1207) = Model 83XX
XX indicates relative performance within the series.
An AMD Opteron Processor Model 2350 is higher performing than an AMD Opteron™ Processor Model 2347, etc.
XX values above 40 indicate a Third-Generation Quad-Core AMD Opteron processor
XX values 40 and below indicate a Third-Generation Dual-Core AMD Opteron processor (available in 1H’08)
HE indicates a 68W low-power AMD Opteron™ processor.
Performance of a low-power AMD Opteron processor HE model number, ZYXX, is equal to the performance of the same model number standard-power version. For example, an AMD Opteron processor Model 2347 HE offers the same performance as a standard wattage AMD Opteron processor Model 2347.
The chart below further explains the differences between AMD Opteron™ processor Series and Model Numbers.
|
Series |
2000 Series |
|
Scalability |
Up to 2-way |
|
Socket |
Socket F (1207) |
|
Standard Power Models |
|
|
Wattage |
55W |
|
Frequency |
Model Numbers |
|
2.2GHz |
Model 2374 HE |
|
Direct Connect Architecture |
Yes |
|
AMD Virtualization™ (AMD-V™) |
Yes |
|
Rapid Virtualization Indexing |
Yes |
|
Tagged TLB support |
Yes |
|
Device Exclusion Vector (DEV) |
Yes |
|
AMD PowerNow!™ technology |
Yes |
|
Independent Dynamic Core Technology |
Yes |
|
Supported power states |
Up to 5 |
|
CoolCore™ Technology |
Yes |
|
Dual Dynamic Power Management (DDPM) |
Supported |
|
Integrated DDR2 memory controller |
Yes |
|
AMD Memory Optimizer Technology |
Yes |
|
DDR2 Memory type supported |
Registered |
|
DDR2 Memory controller width |
128-bit |
|
DDR2 Memory Max Frequency |
DDR2-800 |
|
DDR2 Memory Max DIMM support/CPU |
8 @ DDR2-800 |
|
On-Line spare RAS support |
Yes |
|
ECC DRAM protection |
Yes |
|
Advanced ECC protection |
Yes |
|
HyperTransport™ technology |
Yes |
|
HyperTransport technology links (total/coherent) |
3/1 |
|
HyperTransport technology link width |
16 bits x 16 bits |
|
HyperTransport bus frequency |
2G |
|
AMD64 |
Yes |
|
Simultaneous 32 & 64-bit computing |
Yes |
|
L1 Cache Size (data/instruction) |
64KB/64KB |
|
L1 Cache associativity (data/instruction) |
2-way/2-way |
|
L2 Cache Size (dedicated cache per core) |
4x512KB |
|
L2 Cache associativity (data/instruction) |
8-way/8-way |
|
L3 Cache Size (shared cache) |
6MB |
|
L3 Cache associativity (data) |
32-way |
|
Pipeline stages (integer/floating point) |
12/17 |
|
L1/L2 data cache protection |
ECC |
|
L1/L2 instruction cache protection |
Parity |
|
Global History Counter Entries |
16K |
|
L1 TLB entries 4KB pages (data/instruction) |
48/32 |
|
L1 TLB associativity 4KB pages (data/instruction) |
Full/Full |
|
L1 TLB entries 2/4MB pages (data/instruction) |
48/16 |
|
L1 TLB associativity 2/4MB pages (data/instruction) |
Full/Full |
|
L2 TLB entries 4KB pages (data/instruction) |
512/512 |
|
L2 TLB associativity 4KB pages (data/instruction) |
4-way/4-way |
|
L2 TLB entries 2/4MB pages (data) |
128 |
|
L2 TLB associativity 2/4MB pages (data) |
2-way |
|
AMD Wide Floating-Point Accelerator |
Yes |
|
SIMD Instruction Support |
SSE, SSE2, SSE3, SSE4A |
|
Process |
45 nanometer SOI |
|
Manufactured In |
Fab 36, Dresden, Germany |
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